A holistic approach that treats the stack as a coupled physical system helps overcome thermal, stress, and reliability ...

Two DC stages DC-to-DC conversion typically starts with 48 V (or sometimes 54 V), and first drops it to 12 or 6 V. Then it is ...

With 3D-ICs come new design and verification challenges that must be addressed to ensure successful implementation.

While everybody seems to agree that AI will disrupt semiconductor design and EDA tools, nobody has yet suggested what a ...

As more companies and startups join forces with government and academia in chip design projects, issues around data sharing, ...

AI is a set of algorithms capable of solving problems. But how relevant are they to the tasks that EDA performs?

Microbumps must meet strict planarity requirements. Any stresses exerted during reflow, for instance, have a tendency to ...

Tackling a composite challenge that combines multi-stage task planning, long-context work, environment interaction, and ...

Emerging chiplet, memory, and interconnect technologies demand layered, automated solutions to deliver predictable ...

As packaging integrates diverse substrates, adhesives, and exotic metals, manufacturers must rethink precision from the ...

The evolution of verification may have slowed down, but the industry is hitting a tipping point that will drive some major ...

Equally transformative is the shift in the development process to improve Tenstorrent’s time to market (TTM), enhance ...