A new die-attach process promises to cool power devices up to 15X more efficiently while reducing failure-inducing stresses caused by conventional sintering techniques.

During this process the film frames are baked to cure the die attach material. Process considerations must be accounted for when adding additional thermal mass and also with cassette design to enable ...

The next plasma treatment step is before the die attach process to make sure the surface is contamination-free before the dies are attached. Once the dies are attached, a plasma treatment is applied ...

YINCAE, a specialist in electronic materials, is set to showcase its innovations in underfill, die attach, and liquid metal technologies.

A bondable laser release material that eliminates the requirement for a die attach material from the traditional process flow facilitates the development of cost-effective FOWLP. Published in: IEEE ...

StratEdge announces that the on-demand webinar, “Packages & Eutectic Die Attach for High-power GaN Devices,” is now available on StratEdge website.

Empower Materials presents QPAC® polyalkylene carbonate binders for nano silver sintering paste used in the die attach process in semiconductor manufacturing.

Die attach machine is used for attachment of semiconductor device die and its package. Additionally, it is a backend process of chip manufacturing and also a key component of the semiconductor ...

Die attach is a key process step in semiconductor packaging. It covers all devices across various applications and is a key contributor to assembly cost.