Researchers from Massachusetts Institute of Technology (MIT) and University of Chemistry and Technology Prague created a ...

New security technical papers presented at the August 2025 USENIX Security Symposium.

A holistic approach that treats the stack as a coupled physical system helps overcome thermal, stress, and reliability ...

With 3D-ICs come new design and verification challenges that must be addressed to ensure successful implementation.

Two DC stages DC-to-DC conversion typically starts with 48 V (or sometimes 54 V), and first drops it to 12 or 6 V. Then it is ...

AI is a set of algorithms capable of solving problems. But how relevant are they to the tasks that EDA performs?

As more companies and startups join forces with government and academia in chip design projects, issues around data sharing, ...

Microbumps must meet strict planarity requirements. Any stresses exerted during reflow, for instance, have a tendency to ...

While everybody seems to agree that AI will disrupt semiconductor design and EDA tools, nobody has yet suggested what a ...

Tackling a composite challenge that combines multi-stage task planning, long-context work, environment interaction, and ...

Emerging chiplet, memory, and interconnect technologies demand layered, automated solutions to deliver predictable ...

As packaging integrates diverse substrates, adhesives, and exotic metals, manufacturers must rethink precision from the ...