The rise of 3D integrated circuits (ICs) and heterogeneous packaging is reshaping how automotive ICs fulfill demanding analog and sensor requirements. Whether for ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

Digital photoelasticity is a powerful optical technique that leverages the stress-induced birefringence in transparent materials to map the distribution of internal stresses. The method has evolved ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Stress concentration analysis in composite and orthotropic plates is a critical area of research that addresses the localisation of stress in regions of geometric discontinuity, such as holes or ...