Lidless FCBGA packages maximize PCB real estate by allowing closer spacing between passive components and the flip chip die. Lidless FCBGA packages enable the die to contact with an external heat sink ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...

Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with investment estimated ...

Samsung Electronics has confirmed that it is preparing for the trial production of flip-chip ball grid array (FC-BGA) in Vietnam and plans to start mass production in July 2023 at its factory in Thai ...

SINGAPORE — Singapore's ST Assembly Test Services Ltd. (STATS) is advancing its flip-chip package offering. The chip-packaging supplier has rolled out what it calls the Flip Chip Ball Grid Array with ...

Apple is continuing its work on the upcoming "M2" chip with help from Samsung Electro-Mechanics, ET News reports. Samsung Electro-Mechanics supplies the flip chip ball grid array (FC-BGA), a printed ...

LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...

Samsung Electro-Mechanics is collaborating with Apple on creating the M2 chip, beating out LG Innotek. Samsung is developing the flip chip ball grid array (FC-BGA) for the new generation of Apple ...