ESEC die bonders at IBM in Burlington, Vt. Human inspectors armed with microscopes used to check the die bonds coming out of IBM's Burlington, Vt., facility. Trouble was, it was practical to ...
STOCKHOLM, Feb. 9, 2021 /PRNewswire/ -- MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020". The MRSI-S-HVM ...
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