EDN

DMD powers high-resolution lithography

With over 8.9 million micromirrors, TI’s DLP991UUV digital micromirror device (DMD) enables maskless digital lithography for advanced packaging. Its 4096×2176 micromirror array, 5.4-µm pitch, and ...
Automation World

TI Introduces Its Highest Speed and Resolution DLP Chipset for 3D Printing and Lithography Applications

Texas Instruments (TI) announced the availability of the DLP9000X, its highest speed and resolution chipset for 3D printing and lithography applications. The chipset, consisting of the DLP9000X ...
Electronic Design

How is DLP Tech Powering the Next Wave of Packaging Innovation?

Members can download this article in PDF format. It’s well-known that advanced packaging will separate the haves from the have nots in the race to effectively run artificial intelligence (AI), connect ...
EDN

Digital micromirror device targets advanced packaging

Texas Instruments Inc. (TI) has introduced the DLP991UUV digital micromirror device (DMD), its highest resolution direct imaging solution to date. Developed for digital lithography systems for ...