The main goal of the LCP circuit technology development was to provide a high-speed, high-density alternative to conventional printed circuit fabrication techniques. As semiconductor and electronics ...

RIT recently completed a weeklong training in integrated circuit fabrication technology in support of Finger Lakes Economic Development initiatives. The training about semiconductor industry processes ...

Following trend towards miniaturization, IC manufacturers are under constant pressure to increase the density of interconnects, with the result that conductors with finer lines and spaces are required ...

Choosing a circuit material for a high-frequency printed-circuit board (PCB) is generally a tradeoff, often between price and performance. But PCB materials are also selected by two key factors: how ...

International Statistical Review / Revue Internationale de Statistique, Vol. 61, No. 1, Special Issue on Statistics in Industry (Apr., 1993), pp. 97-107 (11 pages) Statistical tools which depend on ...

Rochester Institute of Technology is upgrading its Semiconductor and Microsystems Fabrication Laboratory (SMFL) to further advance the university’s research in integrated photonics, quantum ...

Electric-field-assisted assembly enables scalable, lithography-free fabrication of logic circuits using 2D semiconductors. It ...

Veteran-led Kupros has figured out a way to dramatically speed up the prototyping process for 3D-printed electronics.