Ansys Inc has announced the latest release of Ansys Icepak software, which provides fluid dynamics technology for electronics thermal management. The 12.0 release introduces new features for ...
Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...
Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...
Ansys lessens barriers to entry, empowers students to enhance electronics-specific simulation skillset and spurs the next generation of innovation Free download expands students’ online access to ...
As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...
United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency, and performance of ...
January 29, 2014. ANSYS at DesignCon debuted new functionality for ANSYS SIwave. ANSYS’ electromagnetic (EM) simulation suite for the design of high-speed printed circuit boards (PCB) and integrated ...
PITTSBURGH, Oct. 19, 2023-- Ansys (NASDAQ: ANSS) multiphysics solutions have been certified by global semiconductor foundry UMC to simulate its latest 3D-IC WoW stacked technology, which will improve ...
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