Micron, Singapore

Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...
MICRON Technology on Wednesday (Jan 8) broke ground in Woodlands for an advanced packaging facility for its high-bandwidth memory (HBM) semiconductor chip. Read more at The Business Times.
Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.
Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore ...